Top Links You Must Click On
From the Wires
Telit Expands its Qualcomm Technologies-based Portfolio with New LTE Concept Product
New 4G LTE Module Based on Qualcomm Technologies Inc.'s Gobi™ MDM9215 Chipset Completes Telit's xE910 Product Line
By: PR Newswire
Feb. 25, 2013 02:30 AM
BARCELONA, Spain, Feb. 25, 2013 /PRNewswire/-- Telit Wireless Solutions, a leading global vendor of high-quality machine-to-machine (M2M) modules and value-added services, today announced the expansion of its long-standing relationship with Qualcomm Technologies, Inc., a wholly owned subsidiary of Qualcomm Incorporated (NASDAQ: QCOM), marked by the introduction of a 4G LTE product and the development of variants for the company's top selling 3G modules in the xE910 product family. The complete portfolio allows Telit to offer form-factor compatible Qualcomm Technologies-based solutions for CDMA, UMTS and LTE radio technologies to address the communications needs of M2M and Internet of Everything (IoE) application developers.
The LE910, based on Qualcomm Technologies' GobiTM MDM9215, will be Telit's first LTE module delivered in the xE910 product family, and the company's second LTE offering, following the LE920 LTE automotive-grade module announced last year, also based on the MDM9215.
In January 2013, Telit introduced two new xE910 modules—the HSDPA UE910 V2 based on Qualcomm Technologies' QSC6270-Turbo chipset and HSPA+ HE910 V2 based on Qualcomm Technologies' MDM6200 chipset—to address the growing demand for 3G solutions. Variants of both products with support for Oracle Java ME Embedded 3.2 are being planned. With the LE910, the xE910 product family is now poised to address not only the 2G to 3G migration, but also the growing set of opportunities and applications that require LTE.
The Qualcomm Technologies' chipsets have enabled Telit to build the xE910 family to provide interchangeability between 3GPP2—CDMA (1xRTT, EV-DO) and 3GPP—UMTS (HSDPA, HSPA+) and LTE variants, making the adaptation of customer applications to regional technical requirements quick and easy while minimizing time to market and total cost of ownership.
In the Telit booth at Mobile World Congress (Hall 5, G70) visitors can glean the breadth of the product portfolio at the "Qualcomm Technologies Corner," including existing and prototype products and their respective chipsets. Included in the display will be the LE910 product concept and a number of commercially available and prototype modules for the automotive industry.
"The increased scope of our relationship with Qualcomm comes at an exciting time, when we are seeing strong demand from the m2m market for our products and solutions," said Oozi Cats, CEO of Telit. "By expanding our portfolio with products such as the LE910 module we can address the 3G and 4G market which were previously beyond our reach."
"We are pleased to work with Telit to bring 4G LTE to the CDMA, HSPA and HSPA+ platforms based on certain Qualcomm Technologies' chipsets," said Nakul Duggal, vice president of product management, new markets, Qualcomm Technologies, Inc. "Qualcomm Technologies has an extensive 3G and 4G LTE chipset portfolio, helping Telit deliver solutions in various product tiers to address the myriad of technical and regional needs of M2M and IoE developers."
Telit has been the M2M community's one stop shop for more than a decade, leveraging the industry's broadest portfolio of hardware in cellular, short range and positioning technologies, artfully complemented by services and connectivity from m2mAIR. By applying products and services in synergizing bundles, delivered with global support and logistics matching each individual need or want, Telit helps to eliminate technical risk, shortening time to market to the Internet of Everything.
Telit Wireless Solutions (AIM: TCM listed under Telit Communications PLC), a global enabler of machine-to-machine (M2M) communications providing cellular, short range and positioning module products; and through its business unit m2mAIR, M2M managed and value added services, including connectivity. Telit is M2M's top one-stop-shop offering synergistic hardware and value added services bundles. With over 12 years exclusively in M2M, the company constantly advances technology through six R&D centers around the globe; and markets products and services in over 80 countries.
By supplying scalable products interchangeable across families, technologies and generations, Telit is able to curb development costs, protect design investments and reduce technical risk. The company provides customer support and design-in assistance through 27 sales and support offices, a global distributor network of experts with over 30 competence centers, and the Telit Technical Support Forum.
Telit connects organizations to the Internet of Things (IoT) allowing them to wirelessly collect, process and respond to real-world data from connected devices, creating new efficiencies, revenue streams, societal and personal benefits. Join the conversation and learn more about Telit and its customers' innovative applications on Facebook and Twitter.
Copyright © 2013 Telit Communication PLC. All rights reserved. Telit, Telit Wireless Solutions, Telit Communication PLC, telit.com, telit2market, Telit Technical Forum, m2mAIR, m2mAIR.com and all associated logos are trademarks of Telit Communications PLC in the United States and other countries. Other names used herein may be trademarks of their respective owners.
Qualcomm and Gobi are trademarks of Qualcomm Incorporated, registered in the United States and other countries. All Qualcomm Incorporated trademarks are used with permission.
Other names used herein may be trademarks of their respective owners.
SOURCE Telit Wireless Solutions
Enterprise Open Source Magazine Latest Stories . . .
Subscribe to the World's Most Powerful Newsletters
Subscribe to Our Rss Feeds & Get Your SYS-CON News Live!
SYS-CON Featured Whitepapers
Most Read This Week