yourfanat wrote: I am using another tool for Oracle developers - dbForge Studio for Oracle. This IDE has lots of usefull features, among them: oracle designer, code competion and formatter, query builder, debugger, profiler, erxport/import, reports and many others. The latest version supports Oracle 12C. More information here.
Cloud Expo on Google News

2008 West
Data Direct
SOA, WOA and Cloud Computing: The New Frontier for Data Services
Red Hat
The Opening of Virtualization
User Environment Management – The Third Layer of the Desktop
Cloud Computing for Business Agility
CMIS: A Multi-Vendor Proposal for a Service-Based Content Management Interoperability Standard
Freedom OSS
Practical SOA” Max Yankelevich
Architecting an Enterprise Service Router (ESR) – A Cost-Effective Way to Scale SOA Across the Enterprise
Return on Assests: Bringing Visibility to your SOA Strategy
Managing Hybrid Endpoint Environments
Game-Changing Technology for Enterprise Clouds and Applications
Click For 2008 West
Event Webcasts

2008 West
Get ‘Rich’ Quick: Rapid Prototyping for RIA with ZERO Server Code
Keynote Systems
Designing for and Managing Performance in the New Frontier of Rich Internet Applications
How Can AJAX Improve Homeland Security?
Beyond Widgets: What a RIA Platform Should Offer
REAs: Rich Enterprise Applications
Click For 2008 Event Webcasts
Top Links You Must Click On

Optomec to Present New Micro Dispense Process Using Aerosol Jet Printer for High Density 3D Packaging

Optomec announced today that Dr. Mike Renn, Optomec Advanced Applications Lab Director, will give a presentation titled "Aerosol Jet Printing of Conductive Epoxy for 3D Packaging" in the Advanced Materials track at the Pan Pacific Microelectronics Symposium in Hawaii. The conference will be held January 22-24 at the Makena Beach and Golf resort in Maui.

Dr. Renn will discuss how traditional dispensing technologies are typically limited to feature sizes above 100 microns and have limited 3D capability due to near or direct-surface contact with the substrate. Conductive adhesives for these systems typically contain large metallic flakes which lead to inconsistent conductivity in small features such as dots. The presentation will explain how a new, nanoparticle conductive adhesive, when dispensed with an Aerosol Jet Printer, demonstrated non-contact printing over 3D surfaces and into recesses such as through silicon vias (TSV). The conductive adhesive, manufactured by Resin Designs, is a high-solids, nanoparticle system with resistivity as low at 5 μW-cm at 150º C cure temperatures. The adhesive has superior thermal conductivity, adhesion, and elasticity, which are desirable for fabricating heterogeneous connections, such as between IC chips and circuit boards. The material can be Aerosol Jet dispensed with dot sizes down to 25 μm, which enables high-density die attach. Similarly, TSV filling has been demonstrated with via diameters down to 50 μm and depths of 300 μm. The high-solids formulation reduces the material shrinkage during curing resulting in a dense conductive plug.

Aerosol Jet printing has mainly been used for dispensing nanosilver inks for photovoltaics, printed circuits, and printed antenna. One major advantage of this system is that fine feature printing, down to 10 μm feature size, can be achieved with a surprisingly large standoff height (up to 10 mm). This capability allows for printing in recessed regions such as vias, over step edges such as SMT devices, and over non-planar substrates such as populated boards. In contrast to other jetting techniques, the ink droplets in the Aerosol Jet system do not actually interact with the surfaces of the nozzle. This feature results in greatly reduced frequency of clogging and less sensitivity to specific ink rheologies, such as viscosity, surface tension and solids loading. For more information on Aerosol Jet printing, click here.

The Pan Pacific Microelectronics Symposium promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world. Conference sessions include Failure Analysis Tools and Techniques, Strategic Directions, 3D Structures, Advanced Materials, Advanced Manufacturing Challenges, Trends, Roadmaps, and more. For details on the conference, go to

Optomec is a privately-held, rapidly growing supplier of Additive Manufacturing systems. These solutions utilize Optomec’s patented Aerosol Jet Printed Electronics technology and LENS Printed Metal technology to reduce costs and improve performance. Together, these unique 2D and 3D printing solutions work with the broadest spectrum of functional materials, ranging from electronic inks to structural metals and even biological matter. Optomec has more than 150 marquee customers around the world, targeting production applications in the Electronics, Energy, Life Sciences and Aerospace industries.

About Business Wire
Copyright © 2009 Business Wire. All rights reserved. Republication or redistribution of Business Wire content is expressly prohibited without the prior written consent of Business Wire. Business Wire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

Enterprise Open Source Magazine Latest Stories . . .
The combined notions of open source and the ‘community contribution’ model of collaborative software application development are, of course, not new. The history of open source is actually traced back to early software exchanges between universities driven by academic principles of kn...
It is no surprise that OpenStack has evolved into a widely adopted cloud management framework. As it hurtles on a trajectory of rapid growth, a new breed of demands are making themselves felt – demands that a mature platform of this nature and scope must satisfy. One such requirement i...
Using any programming framework to the fullest extent possible first requires an understanding of advanced software architecture concepts. While writing a little client-side JavaScript does not necessarily require as much consideration when designing a scalable software architecture, t...
Developers generally like to share their code, and many of them do so by open sourcing it on GitHub, a social code hosting and collaboration service. Many companies also use GitHub as a convenient place to host both private and public code repositories by creating GitHub organizations ...
Test-driven development (TDD) has been around for a while now. Behavior-driven development (BDD), a comparably recent methodology, emerged from the practice of TDD and could reasonably be called a narrower application of TDD. The TDD process allows a developer to use a failing unit t...
Cloud computing delivers on-demand IT resources that provide businesses flexibility. The challenge is the cost and complexity of cloud security compliance (PCI, HIPAA, FFIEC). Raxak Protect automated cloud security enables cloud apps to be deployed quickly and cost-effectively. Get the...
Subscribe to the World's Most Powerful Newsletters
Subscribe to Our Rss Feeds & Get Your SYS-CON News Live!
Click to Add our RSS Feeds to the Service of Your Choice:
Google Reader or Homepage Add to My Yahoo! Subscribe with Bloglines Subscribe in NewsGator Online
myFeedster Add to My AOL Subscribe in Rojo Add 'Hugg' to Newsburst from CNET Kinja Digest View Additional SYS-CON Feeds
Publish Your Article! Please send it to editorial(at)!

Advertise on this site! Contact advertising(at)! 201 802-3021

SYS-CON Featured Whitepapers