Comments
yourfanat wrote: I am using another tool for Oracle developers - dbForge Studio for Oracle. This IDE has lots of usefull features, among them: oracle designer, code competion and formatter, query builder, debugger, profiler, erxport/import, reports and many others. The latest version supports Oracle 12C. More information here.
Cloud Expo on Google News

2008 West
DIAMOND SPONSOR:
Data Direct
SOA, WOA and Cloud Computing: The New Frontier for Data Services
PLATINUM SPONSORS:
Red Hat
The Opening of Virtualization
GOLD SPONSORS:
Appsense
User Environment Management – The Third Layer of the Desktop
Cordys
Cloud Computing for Business Agility
EMC
CMIS: A Multi-Vendor Proposal for a Service-Based Content Management Interoperability Standard
Freedom OSS
Practical SOA” Max Yankelevich
Intel
Architecting an Enterprise Service Router (ESR) – A Cost-Effective Way to Scale SOA Across the Enterprise
Sensedia
Return on Assests: Bringing Visibility to your SOA Strategy
Symantec
Managing Hybrid Endpoint Environments
VMWare
Game-Changing Technology for Enterprise Clouds and Applications
Click For 2008 West
Event Webcasts

2008 West
PLATINUM SPONSORS:
Appcelerator
Get ‘Rich’ Quick: Rapid Prototyping for RIA with ZERO Server Code
Keynote Systems
Designing for and Managing Performance in the New Frontier of Rich Internet Applications
GOLD SPONSORS:
ICEsoft
How Can AJAX Improve Homeland Security?
Isomorphic
Beyond Widgets: What a RIA Platform Should Offer
Oracle
REAs: Rich Enterprise Applications
Click For 2008 Event Webcasts
SYS-CON.TV
Top Links You Must Click On


Semiconductor Market Updates: Networking Equipment Market Slows in Second Half of 2012, Intel Dominates Mid-End Wafers, 3DIC Material Market to Reach $2B in 2017

FARMINGTON, Conn., Nov. 19, 2012 /PRNewswire-iReach/ -- In the networking IC market, growth continues to be driven by infrastructure markets supporting the growing volume of data and users on the Internet. Meanwhile, according to new research from Yole Developpement, the equipment and materials business will quadruple over the next five years in the 3D TSV, FO WLP, 3D WLP, WLCSP, 2.5D interposers and flip-chip wafer segments.

(Photo: http://photos.prnewswire.com/prnh/20121119/CG16190)

Global Information Inc (GII) highlights new market research from our premium partner publishers that will benefit executives involved in the global market for semiconductor materials and manufacturing.

2012 Networking Market Tracker

The overall networking equipment market has slowed in the second half of 2012 with many customers decelerating and reducing spending on hardware. Most of the large equipment OEMs are predicting that fourth quarter revenues will remain flat sequentially from the third quarter, due to exposure to Europe where service providers have cut spending and increasing competition from lower cost domestic equipment makers in China.

The networking IC market consists of products that are used in network equipment including network switches, routers, modems, adapters, cards, line cards, cable infrastructure, DSLAM, and other central office equipment. This market is driven by continued high growth in the infrastructure markets supporting the growing volume of data and users on the Internet.

Capital expenditures for data centers are expected to be up double digits this year, so next year there could be a slowdown. However, this market continues to advance at a pace not seen in other traditional segments. Some OEM customers that serve this market include Cisco Systems, F5 Networks, Juniper Networks, Hewlett Packard, and Huawei. Cisco has the lions share, but the other network equipment providers are steadily gaining momentum in the market.

An Executive Summary for this report and free sample pages from the full document are available at http://www.giiresearch.com/report/data237351-2012-networking-market-tracker.html

Equipment & Materials for 3DIC & Wafer-Level-Packaging

The global material market is expected to grow from approximately $590 million this year to over $2 billion by 2017 at a compound annual growth rate of 24%. Growth in the global market for 3DIC and wafer-level-packaging will be driven mainly by the expansion of 2,5D interposers and 3D TSV& WLP platforms. However, Yole Developpement forecasts a a slight decrease  in 2012 due to the fact that high-volume production in 3D TSV, FO WLP, and 3D WLP has not yet begun.

This report includes an Excel database with detailed activity of over 375 small, medium and large equipment and material suppliers ranging from front-end, back-end assembly, PCB, LCD, and solar divisions.

An Executive Summary for this report and free sample pages from the full document are available at http://www.giiresearch.com/report/yd194054-equipment-materials-3dic-wafer-level-packaging.html

Wafer Packaging Fabs Database 2012

Stay informed on global wafer-scale packaging activity of 275 middle-end factories with this new database from Yole Developpement.  This unique tool provides a global overview of "who is doing what" in this emerging ecosystem. The database provide details concerning each fab location by fab function, customers, JV, capacities by wafer size, and more.

Major companies cited in the database include: Amkor, Analog Devices, ASE, ASTRI, Avago, Bosch, BEA-LETI, China WLCSP, ChipBond, ChipMOS. EPCOS-TDK, Epson Electronics, Fairchild, Flip Chip international, Flip Chip Millennium, Fraunhofer, Freescale, Fujikura, Fujitsu Integrated Microtechnology, Global

Foundries, IBM, IMEC, Infineon, INTEL, ITRI, JCET, Maxim IC, NANIUM, NEPES, NXP, OptoPAC, PTI, Renesas, Rohm, Samsung, SMIC, SK Hynix, Sony, SPIL, STATS ChipPAC, STMicroelectronics, Teramikros, Texas Instrument, Tezzaron, Toshiba, TriQuint, TSMC, UMC Global, and Xintec.

An Executive Summary for this report and free sample pages from the full document are available at http://www.giiresearch.com/report/yd206538-wafer-packaging-fab-database.html

About Global Information Inc. Global Information (GII) (http://www.giiresearch.com) is an information service company partnering with over 300 research companies around the world. Global Information has been in the business of distributing technical and market research for more than 25 years. Expanded from its original headquarters in Japan, Global Information now has offices in Korea, Taiwan, Singapore, Europe and the United States.

Media Contact:

Jeremy Palaia Global Information, Inc., 1-860-674-8796, Press@gii.co.jp

News distributed by PR Newswire iReach: https://ireach.prnewswire.com

SOURCE Global Information, Inc.

About PR Newswire
Copyright © 2007 PR Newswire. All rights reserved. Republication or redistribution of PRNewswire content is expressly prohibited without the prior written consent of PRNewswire. PRNewswire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

Enterprise Open Source Magazine Latest Stories . . .
"Our premise is Docker is not enough. That's not a bad thing - we actually love Docker. At ActiveState all our products are based on open source technology and Docker is an up-and-coming piece of open source technology," explained Bart Copeland, President & CEO of ActiveState Software,...
This past week the Appcore team got the opportunity to attend one of the industry’s leading cloud events, Cloud Expo in Santa Clara, CA. We spent a lot of time interacting with attendees at the exhibit portion of the event. As a software company with a sole commitment to CloudStack, we...
As cloud gives an opportunity to businesses to buy services externally – how is cloud impacting your customers? In his General Session at 15th Cloud Expo, Fabio Gori, Director of Worldwide Cloud Marketing at Cisco, provided answers to big questions: Do you see hybrid cloud as where th...
Microsoft Azure, a cloud platform, is rapidly expanding its scope to include newer enterprise class services. Some of the significant new additions are: Azure Search: Azure Search Service is a fully managed, cloud-based service that allows developers to build rich search applications ...
Since the announcement of Docker approximately 18 months ago there has been an explosion of new technology in this space. Although the list is becoming very long, here I will outline five evolving Docker-related technologies that are driving the direction that cloud technology is going...
Cloud Expo 2014 TV commercials will feature @ThingsExpo, which was launched in June, 2014 at New York City's Javits Center as the largest 'Internet of Things' event in the world. The next @ThingsExpo will take place November 4-6, 2014, at the Santa Clara Convention Center, in Santa ...
Subscribe to the World's Most Powerful Newsletters
Subscribe to Our Rss Feeds & Get Your SYS-CON News Live!
Click to Add our RSS Feeds to the Service of Your Choice:
Google Reader or Homepage Add to My Yahoo! Subscribe with Bloglines Subscribe in NewsGator Online
myFeedster Add to My AOL Subscribe in Rojo Add 'Hugg' to Newsburst from CNET News.com Kinja Digest View Additional SYS-CON Feeds
Publish Your Article! Please send it to editorial(at)sys-con.com!

Advertise on this site! Contact advertising(at)sys-con.com! 201 802-3021




SYS-CON Featured Whitepapers
ADS BY GOOGLE